Xpedition™ Package Designer (xPD) 软件专为新兴高密度先进封装 (HDAP ... 准确识别 EM 电流密度违规情况，以及为 3D-IC 封装设计提供准确的提取和建模。 将 2.5D 3D IC 物理验证提升到更高水平 随着封装设计的发展，验证要求和挑战如影相随。设计人员在处理 2.5/3D IC 设计 ...

GENIO EVO, an integrated chiplet/package EDA tool, addresses thermal and mechanical stress in the pre-layout stage of 3D IC ...

集成电路，晶体管，3D-IC, PlanarFET, FinFET, GAAFET, CFET, 晶体管群，Transistor Group，晶体管结构的3D化，晶体管的3D结构，晶体管的3D集成，晶体管群的3D ...

will package the 3D stack using flip-chip onto a FBGA (fine-pitch ball-grid array) substrate. “We are excited to achieve this milestone in collaboration with our 3D integration partners including ...