With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect, it is vitally important to make solid contact with the Printed Circuit Board (PCB).
The Ball Grid Array (BGA) Package Market is poised for steady growth as the demand for compact, high-performance Semiconductor packaging continues to rise. Valued at $4.6 billion in 2023 ...
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