the compute die will likely be built using Intel's 18A process technology, which is in the 1.8nm range. Furthermore, Intel is ...
The Intel 8088 (and its big brother 8086) processor was among the first microprocessors to implement (instruction) prefetching in hardware, which [Ken Shirriff] has analyzed based on die images ...
Being at the center of the package, the SoC Tile will have the most Die to Die interconnects, as it has to communicate with ...
Today, they’ve revealed the launch of the Intel 1851 Delid-Die-Mate Heater V1. This innovative tool is designed to safely remove the heat spreader from Intel Core Ultra 200 CPUs using the Intel ...
All of Intel's Core Ultra CPUs have used chiplet-based designs, which means that every processor die is actually a collection of smaller silicon tiles fused together with a "base tile" that ...