Semiconductor Engineering13d
Liquid-Infused Nanostructured Composites As A Universal Thermal Interface Solution for Cooling Applications
A new technical paper titled “Liquid-infused nanostructured composite as a high-performance thermal interface material for ...
Business Wire12d
TDK Ventures Invests in NovoLINC’s Advanced Thermal Interface Solutions for Next Generation AI Computing
TDK Corporation (TSE: 6762) announced today that subsidiary TDK Ventures, Inc. has invested in thermal interface solution innovator NovoLINC, a Pittsb ...