The demand for consistently high electrical performance in the power discrete semiconductor market has driven component developers to continuously enhance semiconductor assembly packaging technology ...

Demand for precise Semiconductor manufacturing drives growth in the Wafer Dicing Saws Market, enabling innovation in microelectronics. Wafer dicing saws are at the heart of microchip production ...

Let's rewind to 2013 and the A7, Apple's first 64-bit chip built on TSMC's 28nm process. At the time, those 28nm wafers cost ...

The analysis showed that the surface roughness of the wafers decreases with the increase in the usage time of the saw wire. It also demonstrated that the curvature of the saw marks on the wafer ...

A new way to make ultra-thin diamond wafers using sticky tape could help produce diamond-based electronics, which might one day be a useful alternative to silicon-based designs. Diamond has ...

The Precision Machines division includes dicing saws, laser saws, grinders, polishers, wafer mounter, die separator, surface planer, and water jet saws. The Precision Processing Tools offers ...

China currently has 44 semiconductor wafer fabs in operation and a further ... Despite the technology breakthroughs with Huawei, SMIC saw its third quarter revenue decline 15 per cent year on ...