Before the advent of flip chips and solder ball techniques, wire bonding was the traditional interconnection method to and from the chip. See flip chip and chip package. THIS DEFINITION IS FOR ...
A recent cyberattack on a Michigan township has exposed weaknesses in the bond-closing process. In this incident, hackers stole over $25 million ...
Delamination occurs when there is a mismatch in coefficients of thermal expansion (CTE) between the encapsulate materials, such as the mold compound used to encapsulate the semiconductor chip and the ...
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