Before the advent of flip chips and solder ball techniques, wire bonding was the traditional interconnection method to and from the chip. See flip chip and chip package. THIS DEFINITION IS FOR ...

不同封装形式对材料的要求也不同，我们已在Wire Bond类封装基板产品大批量应用，主要应用于传感器、卡类、射频、摄像头、指纹识别、存储类等 ...

A recent cyberattack on a Michigan township has exposed weaknesses in the bond-closing process. In this incident, hackers stole over $25 million ...