The 3D-stacked accelerator is stacked on the silicon interposer with 2.5D packaging technology before being surrounded by the other chiplets, including the HBM that feeds the accelerator as fast ...

According to market analyst Boston Consulting Group, the market for advanced microchip packaging is expected to grow to more than 96 billion dollars by 2030. For Trumpf and Schmid, advanced packaging ...

The semiconductor industry is under increasing pressure to adopt sustainable practices. Advanced packaging technologies can ...

The CoWoS-S advanced packaging technology uses a single silicon interposer and through-silicon vias (TSVs) to facilitate the direct transmission of high-speed electrical signals between the die and ...

High-end performance packages with 2.5D/3D approaches are used today to package AI processors like GPUs, and AI ASICs, as ...

High density and complex connectivity introduce new challenges for packaging design and assembly manufacturing validation.

Siddhartha Sinha, principal member of technical staff, explains how imec has achieved seamless InP Chiplet integration on ...

Interposer: A silicon substrate that sits ... All of this falls under the general category of semiconductor packaging. If you think of semiconductor chips as buildings in a city, you can either ...

SAN FRANCISCO – Feb. 18, 2020 – Leti and List, institutes of CEA-Tech, reported a high-performance processor breakthrough using an active interposer as a modular and energy- efficient integration ...

It's actually increasing capacity into CoWoS-L." TSMC's CoWoS-S is a high-end 2.5D packaging technology that uses a silicon interposer to connect chiplets in a system-in-package. This technology ...