Nvidia's new Blackwell roadmap for 2025 prioritizes multi-die variants with CoWoS-L packaging, impacting CoWoS-S suppliers.

UMC Q4'24 results disappoint with margin pressures. Recovery expected in 2025, but pricing remains a risk. Explore more ...

CoWoS-S and CoWoS-L, are packaging technologies made by TSMC. CoWoS-S, or Chip on Wafer on Substrate with silicon interposer, offers high density interconnects and deep trench capacitors over a ...

Y.L. Wang, VP of fab operations at TSMC, will be elevated to senior VP for his efforts in resolving challenges at the foundry's advanced fab location in Arizona, US, according to... At 12:17 a.m ...

What just happened? As the world's leading semiconductor manufacturer, TSMC's production halt following the 6.4-magnitude earthquake in Taiwan has triggered industry-wide concern. Its customers ...

TSMC, the world's largest contract semiconductor manufacturer, reported Thursday that its net income increased 57% year-over-year to NT$374.68 billion, or $11.6 billion. Revenue between October ...

TSMC said it evacuated personnel from some buildings and the science park in Tainan, Taiwan. TSMC said that buildings there started evacuations when the quake first hit. TSMC’s Fab 18 ...

IGMTLSY01A is a synchronous LVTLL / LVT / ULVT periphery high-density ternary content addressable memory (TCAM) with column redundancy feature. It is developed with TSMC 5nm 0.75V/1.2V CMOS ...

TSMC reported net income of $11.6 billion in its fourth-quarter earnings Thursday. The company, which makes chips for Nvidia and Apple, is riding the AI boom. TSMC's CFO said its results were ...