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Compoundsemiconductor.net
6 小时
PseudolithIC raises $6M for heterogeneous chiplet tech
The PseudolithIC technology is claimed to offer the high performance of a monolithic microwave IC (MMIC), but at a fraction ...
Compoundsemiconductor.net
1 天
IQE and Quintessent partner on QD lasers for AI
Compound semiconductor wafer company IQE has strengthened its partnership with Quintessent, a pioneer in quantum dot laser ...
2 天
Latest death notices across Wales as families remember loved ones
Announcing the passing of a loved one in local news media is a long standing tradition and we are proud of the trust placed ...
2 天
E6 Claims Its Groundbreaking Copper-Diamond Heatsinks Will Keep Chips Chill
A De Beers subsidiary claims that it can manufacture composite heatsinks with insane thermal conductivity in complex shapes.
eVnExpress on MSN
4 天
90% of Singaporean households have claimed $220 vouchers from cost-of-living support scheme
Nearly 90%, or 1.2 million, of Singaporean households have claimed the S$300 (US$220) worth of Community Development Council (CDC) vouchers launched earlier this month to help with daily expenses.
Punters.com.au
4 天
Sunshine Coast preview and tips: Saturday, January 25
Racenet iQ's Graeme Carey provides his tips and analysis for racing at Sunshine Coast on Saturday.
4 天
Company develops copper-diamond composite for better heatsink cooling — lower CPU and GPU ...
E6, a De Beers Group company, is developing a copper-diamond composite material to serve as a more effective heatsink.
Semiconductor Engineering
5 天
Global IC Fabs And Facilities Report: 2024
Companies poured billions into fabs and facilities around the world as regions continue to build self-sufficiency and form ...
5 天
Nearly 1.2 million Singaporean households have claimed CDC vouchers
Over $132 million has been spent at participating hawker and merchant businesses and supermarkets. Read more at ...
New Electronics
5 天
Copper diamond composite set to power advanced semiconductor devices
Element Six (E6), a leading developer of synthetic diamond advanced material solutions, is to launch a Cu-diamond product at ...
Semiconductor Engineering
5 天
Electrifying Everything: Power Moves Toward ICs
Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.
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