High-end performance packages with 2.5D/3D approaches are used today to package AI processors like GPUs, and AI ASICs, as ...

The AI cluster connects to the front-end networks via Ethernet through a network interface card (NIC), which can go up to ...

Chuck was also the moderator for the opening plenary session Chiplets: Where We Are Today. The speakers were Jim Handy of ...

More specifically, it combines 2.5D packaging with a wider interface at a lower clock speed (as compared to ... The PHY is also designed for a 2.5D system with an interposer for routing signals ...

After hours: February 3 at 6:40:00 PM EST ...

When we first started The Next Platform a decade ago, there was not really much of a reason to cover the company’s datacenter ...

涵盖可持续电子、绿色电子、材料和制造印刷电路板（PCB）、集成电路（IC）、电子废物、能源效率、水管理和电子立法。