High-end performance packages with 2.5D/3D approaches are used today to package AI processors like GPUs, and AI ASICs, as ...

The CoWoS-S advanced packaging technology uses a single silicon interposer and through-silicon vias (TSVs) to facilitate the direct transmission of high-speed electrical signals between the die and ...

The 3D-stacked accelerator is stacked on the silicon interposer with 2.5D packaging technology before being surrounded by the other chiplets, including the HBM that feeds the accelerator as fast ...

The semiconductor industry is under increasing pressure to adopt sustainable practices. Advanced packaging technologies can ...

It incorporates active components in the silicon interposer, which is intended to enhance chip design and packaging flexibility. It is also less expensive than the CoWoS-S. "As we move into ...

CoWoS-S and CoWoS-L, are packaging technologies made by TSMC. CoWoS-S, or Chip on Wafer on Substrate with silicon interposer, offers high density interconnects and deep trench capacitors over a ...

Siddhartha Sinha, principal member of technical staff, explains how imec has achieved seamless InP Chiplet integration on ...

Assembly design kits will greatly increase efficiency, but custom methods prevail for now. Process design kits (PDKs) play an ...

The TSV connections from top to bottom of the interposer make it a versatile and efficient packaging system. Silicon interposers have a variety of advantages over printed Circuit Board (PCB) ...

The AI cluster connects to the front-end networks via Ethernet through a network interface card (NIC), which can go up to ...