Q4 2024 Earnings Call Transcript February 10, 2025 Amkor Technology, Inc. beats earnings expectations. Reported EPS is $0.43, ...

High-end performance packages with 2.5D/3D approaches are used today to package AI processors like GPUs, and AI ASICs, as ...

The high bandwidth memory market thrives on HPC expansion, demanding stacked solutions, advanced interposers, and seamless integration, enabling faster data flows, lowered latency, and elevated ...

The semiconductor industry is under increasing pressure to adopt sustainable practices. Advanced packaging technologies can ...

Siddhartha Sinha, principal member of technical staff, explains how imec has achieved seamless InP Chiplet integration on ...

As the demand for high-performance computing (HPC) continues to grow, chiplets and heterogeneous integration have emerged as key solutions due to their significant advantages in improving yield, ...

Moreover, the simulations also suggest that changes in TGV pitch below 100 μm do not significantly impact the temperature variation. The electrical transmission through the glass interposer package is ...

UMC is also committed to collaborating with Intel Corp in developing 12-nanometer technology, Wang said. In addition, UMC is broadening its advanced chip packaging product offerings beyond the 2.5-D ...

The CoWoS-S advanced packaging technology uses a single silicon interposer and through-silicon vias (TSVs) to facilitate the direct transmission of high-speed electrical signals between the die and ...

The technology involves directly packaging multiple processors on a silicon interposer, or electrical interface. It offers higher data transfer rates and efficiency, making it suitable for AI ...

It incorporates active components in the silicon interposer, which is intended to enhance chip design and packaging flexibility. It is also less expensive than the CoWoS-S. "As we move into ...

TL;DR: NVIDIA is shifting from CoWoS-S to CoWoS-L advanced packaging for its Blackwell AI GPUs, requiring increased capacity from TSMC, the leader in semiconductor technology. This transition aims ...