Abstract: Laser soldering process was introduced in Universal serial bus (USB) 2.0 electric connector to improve the mechanical and electrical bonding reliability. While, the effects of laser ...

This study investigates the reliability of solder joints in Ball Grid Array (BGA) packages by examining their dynamic response under board-level drop impacts using Finite Element methods. Explicit ...

The most common failure mode for his chips is “cratering” which is a type of damage to the solder that holds them to their PCBs. With so many pins in such a small area, and with small pins ...

LEDs were once little more than weedy little indicators with low light output. Today, they’re absolute powerhouses, efficiently turning a flow of electrons into a searing beam of light.

Nate Tice and Charles McDonald are break down the biggest storylines and questions looming over the NFL this offseason, starting with Aaron Rodgers and the Jets parting ways. Responding to a ...