Abstract: To show the capability and diversity of finite element analysis, we calculate three-dimensional planar anisotropic stress distributions for various thin-film geometries and materials in ...
Use precise geolocation data and actively scan device characteristics for identification. This is done to store and access ...
MZ Technologies, a leading supplier of innovative solutions and methodologies for 2.5 and 3D design, today unveiled GENIO EVO ...
In the world of engineering design, conventional linear analysis methods often fail to address the intricate, nonlinear ...
In a bid to minimise the use of nickel deployed within the nuclear sector, the US Argonne National Laboratory has developed a ...
Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.
GENIO EVO, an integrated chiplet/package EDA tool, addresses thermal and mechanical stress in the pre-layout stage of 3D IC ...
Utility AES Indiana and software provider Camus said in a study that the utility can best reduce costs by preparing now to ...
Heat exchangers are central to a variety of fluid processing and heat transfer or capture systems, by delivering efficient thermal energy transfer between fluids. With advancements in materials, flow ...