Taiwanese media outlet Economic Daily News reported that TSMC has completed limited risk production of around 5,000 wafers using its 2nm process at the Baoshan fab in Hsinchu Science Park. Why it ...

Semiconductor FOUP and FOSB are the containers to transfer the wafers safely. The Semiconductor FOUP and FOSB can be opened and closed with the help of robot to support the existing automation in the ...

The belt is driven by the motor of the lifting device and automatically grabs the FOUP (Front Open Unified Pod) set at the port. It realizes the fast and stable transportation of wafers in each ...

FOUP and FOSB are the containers to transfer the wafers safely. The FOUP and FOSB must comply with the semiconductor industry standards such as M31, E15.1, E57, E62 and others. The FOUP and FOSB are ...

FOUP and FOSB are the containers to transfer the wafers safely. The FOUP and FOSB must comply with the semiconductor industry standards such as M31, E15.1, E57, E62 and others. The FOUP and FOSB ...

随着先进制程技术的飞速发展，对晶圆盒的性能要求日益严格，其中，FOUP（Front Opening Unified Pod，前开式统一晶圆盒）和FOSB（Front Opening Shipping Box ...

The growing demand for AI chips is propelling this evolution of fan-out packaging technologies from wafer-level (FO-WLP) to panel-level (FO-PLP) for more chip integration in devices. Seizing this ...