TSMC introduced "Wafer Manufacturing 2.0" in July 2024, integrating packaging, testing, and photomask production into its portfolio. This move underscores a seismic shift in the advanced packaging ...

The demand for consistently high electrical performance in the power discrete semiconductor market has driven component developers to continuously enhance semiconductor assembly packaging technology ...

It helps monitor plating chemicals used for wafer level packaging processes like TSV, RDL, UBM and Micro Bumping processes like fan-out, SOC, and others. The QUALI-FILL ® LIBRA A system has been ...

Ideal for MEMS, SOI, wafer level packaging and optoelectronic applications ... and fixtures are used in SUSS' ABC200 and CBC200 production cluster tools which allows easy technology process transfer ...

MOUNTAIN VIEW, Calif., Aug. 25, 2020 -- Synopsys, Inc. (Nasdaq: SNPS) today announced that Synopsys and TSMC have collaborated to deliver certified design flows for advanced packaging solutions using ...