And there are scaled down bridges being developed at a fraction of the price of an interposer, although exactly how much these will cost isn’t clear. So far, only Intel has a commercially available ...

The 3D-stacked accelerator is stacked on the silicon interposer with 2.5D packaging technology before being surrounded by the other chiplets, including the HBM that feeds the accelerator as fast ...

The CoWoS-S advanced packaging technology uses a single silicon interposer and through-silicon vias (TSVs) to facilitate the direct transmission of high-speed electrical signals between the die and ...

Siddhartha Sinha, principal member of technical staff, explains how imec has achieved seamless InP Chiplet integration on ...

As the demand for high-performance computing (HPC) continues to grow, chiplets and heterogeneous integration have emerged as key solutions due to their significant advantages in improving yield, ...

High-end performance packages with 2.5D/3D approaches are used today to package AI processors like GPUs, and AI ASICs, as ...

SAN FRANCISCO – Feb. 18, 2020 – Leti and List, institutes of CEA-Tech, reported a high-performance processor breakthrough using an active interposer as a modular and energy- efficient integration ...

It's actually increasing capacity into CoWoS-L." TSMC's CoWoS-S is a high-end 2.5D packaging technology that uses a silicon interposer to connect chiplets in a system-in-package. This technology ...

The one-stop advanced packaging platform and service developed through collaboration between Faraday ... The two companies work together to offer comprehensive Chiplet SoC/interposer design ...

It incorporates active components in the silicon interposer, which is intended to enhance chip design and packaging flexibility. It is also less expensive than the CoWoS-S. "As we move into ...