High-end performance packages with 2.5D/3D approaches are used today to package AI processors like GPUs, and AI ASICs, as ...

The AI cluster connects to the front-end networks via Ethernet through a network interface card (NIC), which can go up to ...

The high bandwidth memory market thrives on HPC expansion, demanding stacked solutions, advanced interposers, and seamless integration, enabling faster data flows, lowered latency, and elevated ...

The semiconductor industry is under increasing pressure to adopt sustainable practices. Advanced packaging technologies can ...

Assembly design kits will greatly increase efficiency, but custom methods prevail for now. Process design kits (PDKs) play an ...

Siddhartha Sinha, principal member of technical staff, explains how imec has achieved seamless InP Chiplet integration on ...

According to market analyst Boston Consulting Group, the market for advanced microchip packaging is expected to grow to more than 96 billion dollars by 2030. For Trumpf and Schmid, advanced packaging ...

Moreover, the simulations also suggest that changes in TGV pitch below 100 μm do not significantly impact the temperature variation. The electrical transmission through the glass interposer package is ...

UMC is also committed to collaborating with Intel Corp in developing 12-nanometer technology, Wang said. In addition, UMC is broadening its advanced chip packaging product offerings beyond the 2.5-D ...

These plans now face uncertainty as Intel has suspended its intended construction of an advanced packaging facility in the country. Export controls create division The Biden administration's ...

The CoWoS-S advanced packaging technology uses a single silicon interposer and through-silicon vias (TSVs) to facilitate the direct transmission of high-speed electrical signals between the die and ...

The global electric vehicle industry faces an immediate reset as Donald Trump returns to the White House. Markets are already reacting to his promised dismantling of key industry policies ...