“There is overall agreement that silicon interposers are expensive, and that fan-outs can do everything that a silicon interposer can do,” said Ram Trichur, director of business development for Brewer ...

The CoWoS-S advanced packaging technology uses a single silicon interposer and through-silicon vias (TSVs) to facilitate the direct transmission of high-speed electrical signals between the die and ...

It's actually increasing capacity into CoWoS-L." TSMC's CoWoS-S is a high-end 2.5D packaging technology that uses a silicon interposer to connect chiplets in a system-in-package. This technology ...

It incorporates active components in the silicon interposer, which is intended to enhance chip design and packaging flexibility. It is also less expensive than the CoWoS-S. "As we move into ...

High-end performance packages with 2.5D/3D approaches are used today to package AI processors like GPUs, and AI ASICs, as ...

Siddhartha Sinha, principal member of technical staff, explains how imec has achieved seamless InP Chiplet integration on ...

It incorporates active components in the silicon interposer, which is intended to enhance chip design and packaging flexibility. It is also less expensive than the CoWoS-S. "As we move into ...