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来自MSN
6 天
西电集成电路学部苏杰副教授以共同第一作者在Science发表研究成果
近日,西安电子科技大学集成电路学部在实现钙钛矿太阳能电池商业化上取得重要突破,研究成果以“Wafer-scale monolayerMoS2film integration for stable, efficient perovskite solar ...
来自MSN
3 天
TSV太贵了,制造3D芯片,新办法
如果您希望可以时常见面,欢迎标星收藏哦 ~ 对电子元件三维 ( 3D ) 集成的需求正在稳步增长。尽管存在巨大的加工挑战,硅通孔 ( TSV ) 技术仍是集成 3D 格式单晶器件元件的唯一可行方法。尽管单片 3D ( M3D:monolithic ...
网易
5 天
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