The global ball grid array (BGA) packaging market is poised for steady growth, with market size projected to reach USD 1.29 ...

Researchers at the University of California- Santa Barbara have devised a new framework that could contribute to this quest, enabling the fabrication of scalable three-dimensional (3D) field-effect ...

Department of Materials Science, National Engineering Lab for TFT-LCD Materials and Technologies, Fudan University, Shanghai 200433, China ...

The most sophisticated background location-tracking & geofencing module with battery-conscious motion-detection intelligence for iOS and Android.

TSMC’s most advanced 300mm fab cost $20 billion. For decades, the IC industry kept pace with Moore’s Law, doubling transistor density every 18 to 24 months in order to add more functions onto a die.

The transistor and interconnect are connected by a layer called the middle-of-line (MOL). The MOL consists of tiny contact structures. IC scaling, the traditional way of advancing a design, shrinks ...