Phys.org on MSN13 天
Plasma technique doubles etch rate for 3D NAND flash memoryTo store ever more data in electronic devices of the same size, the manufacturing processes for these devices need to be ...
To improve data storage, researchers are perfecting 3D NAND flash memory, which stacks cells to maximize space. Researchers ...
Edge Line,Edge Of The Wafer,Etching,Etching Process,Integration Process,Number Of Processing Steps,Plasma Etching,Process Emulator,Real Process, ...
7 天
tom's Hardware on MSNFrom toilets to chips — Toto's electrostatic chucks are becoming a crucial element of ...In contemporary semiconductor manufacturing, electrostatic chucks (ESCs) securely hold a silicon wafer (or other substrate) ...
The narrow, deep holes required for one type of flash memory are made twice as fast with the right recipe, which includes a plasma made from hydrogen fluoride.
Tokyo Electron (TEL) has reaffirmed its positive annual outlook and announced plans to invest JPY104 billion (approx. US$685 ...
Tokyo Electron Ltd. lowered its forecast for the silicon wafer market, adding to a mixed picture around elevated AI ...
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